Technical documentation
Contents |
Snowball board
The Product Brief gives an overview of the features of the Snowball board.
There is also a detailed hardware reference manual available.
The Snowball board uses the same ST-Ericsson SoC (System on Chip) as mobile phones and other mobile devices soon to be released by various vendors. In order to make sure that commercial products are not compromised using tools or information publicly available for Snowball. For this reason the initialization code in Snowball must be signed. This signed software is not open source.
The signed code is executed before u-boot, and the tool chain will insert a small partition ("config") on the eMMC to hold it. From u-boot it is possible to execute anything, e.g. a Linux Kernel. The default u-boot looks for partitions named "boot" and "root" on either the on-board eMMC or the SD card.
Here is a description of the organization of the config partition.
Board versions and markings
* SDK = Software development Kit (No expansion connector)
* PDK = Product development Kit (Expandable trough MIPI 34 contact)
Learn here how to interpret the label on the underside of the board
Feature matrix for the different board versions
The board and its components
Schematics for the different board versions can be found on Calao's file repository for PDK, SDK, PDK Lite and SDK Lite.
The documents are named after the following legend:
| SCH-* | Schematics |
| TAY-* | Board top view |
| BAY-* | Board bottom view |
| 100-00103-* | Bill of materials |
| *-BXY | Revision identification |
Don't forget to check the Design Guidelines page for recommendations and updates.
Physical Size
The circuit board is 85mm x 85mm, though the CVBS connector and the power button extrude to make one dimension roughly 98mm. The height of the board is 21mm, the ethernet connector being that tallest feature on the board.
The weight of the board is 54g for SDK and 58g for the PDK.
NOVA A9500 Chipset
AP9500 reference manual. Salestype v2.2 = "AP9500BBP2THM1" (tape) or "AP9500BBP2YHM1" (tray).
AB8500 reference manual. Salestype v3.3 = "AB8500-MB1TO04" (tape) or "AB8500-MB1YO04" (tray).
AV8100 reference manual. Salestype v2.2 = "AV8100D)RT".
Memory
- LpDDR2 PoP memories qualified with AP9500 (maximum size is 8 Gbits):
* Elpida 2x4Gbits : EDB8132B3PB * Micron 4x2Gbits : MT42L256M32D4 * Micron 2x2Gbits : MT42L128M32D2KL * Hynix 4x2Gbits : H8TJR00X0MLR, being replaced by H9TKNNN8JDMPLR.
- eMMC memories qualified with AP9500:
* Micron 4GBytes : MTFC4GGQDI-IT * Micron 8GBytes : MTFC8GKQDI-IT * Hynix * Sandisk
WLAN, Bluetooth, GPS
The IEEE 802.11 b/g/n WLAN chip and Blutetooth-GPS-(FM) chip are integrated in the same SIP module.
AW-NH580 databrief and datasheet
Accelerometer and magnetometer
The accelerometer and magnetometer are integrated in the same chip.
LSM303DLH Datasheet (in up to V6 board revisions)
LSM303DLHCTR Datasheet (in V7 and later board revisions)
Barometer
The barometer is a chip that has a hole on it. DO NOT POKE INTO IT WITH ANYTHING. You can manipulate the readings by pressing gently with your finger over the hole (to increase air pressure inside). But do so knowing that there is a risk of damage.
LPS001WP Datasheet
Gyroscope
L3G4200D Datasheet
LAN
LAN9221 Datasheet
USB
FT232R USB UART IC Datasheet
